Give your staff the
competitive edge
of CMP insight and knowledge.

Version 4.4

Now available from
Scott Runnels Consulting.

Using Mesa's physically-based model
of CMP, your staff can see and explore

• The physics of pad-wafer interaction
• How and when materials are cleared
• How 3D patterns affect polish performance
• Effects of multiple slurries, different pad properties, process variations, and much more

Nothing can replace actually watching the important CMP mechanisms at work. And only Mesa provides this information in an easy-to-use environment. Using Mesa yields insight that is difficult to gain any other way. Anyone involved in CMP can benefit from using it.

Mesa has been successfully validated on

• Oxide,
• Copper, and
• STI processes.

Click here to find out more or forward this to a colleague.

We appreciate your interest. Thank you!

Introduction to Mesa Video
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