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Semiconductor Manufacturing:

Chemical-Mechanical Planarization (CMP)

• 11 years of experience in developing multi-physics and compact models for CMP.
• Over 300 pages of technical results developed for five leading-edge customers.
• 7 hours of CMP modeling training materials for three venues.
• Developer and tester of novel Run-to-Run control algorithms for Copper CMP.

Interconnect Reliability Analysis

• SEM-based stereoimaging and probabilistic mechanics applied to the characterization of metal interconnects.
• Leading of a cross-corporate promotional effort to develop a multi-year funded research effort for Southwest Research Institute(TM).

Packaging

• Thermal analysis of laser bonding for tape automated bonding.
  

Railroad

• Renovation, support, and training of software for modeling the effects of fire on tank cars.
• Thermal and mechanical modeling.

Aerospace

High-Altitude Ballooning

• Custom thermal analysis code for the heat sealing of polyethylene.
• Modeling and testing of automated ballasting algorithm for long-duration flights.
• Renovation of balloon design software.
• Renovation of balloon thermal trajectory software.

Research and Development

• Design and implementation of cross-corporate partnerships for technology development.
• Conversion of simulation capabilities into decision-making tools.

Scott Runnels Consulting
505-695-9241 (Voice)
505-662-0448 (FAX)

srunnels@srconsult.com

Copyright 2002-2006 Scott Runnels Consulting